Industry Overview
LSR overmolding onto metal, glass, or plastic substrates combines the structural benefits of rigid materials with the comfort, sealing, and design flexibility of silicone. This technology is widely used in USB-C connectors, buttons, sensors, and functional components.
YRlims Technical has extensive experience in heterogeneous material overmolding. We have successfully provided overmolding solutions for multiple renowned brands, including USB-C interface overmolding, button overmolding, and sensor encapsulation.
Technical Challenges
Surface Treatment
Proper surface preparation of substrates (metal, glass, plastic) is critical for strong bonding between LSR and the base material.
Structural Design
Overmolding requires careful design of undercuts, bonding grooves, and interface geometry to ensure reliable mechanical interlocking.
Adhesion Strength
Achieving durable adhesion between LSR and various substrates requires proper surface treatment and material selection.
Thermal Expansion
Different thermal expansion coefficients between materials require careful design to avoid delamination during temperature cycling.
Our Solutions
- Surface Treatment Expertise: Comprehensive surface treatment processes including plasma treatment, priming, and adhesive promotion
- Structural Design Support: Professional DFM analysis for overmolding interface design and undercut optimization
- Material Matching: Specialized LSR grades formulated for optimal adhesion to specific substrate materials
- Process Control: Precise temperature and pressure control during overmolding for consistent quality
Key Process Points
Surface Treatment
Plasma & primer treatment
Structural Design
Metal/plastic + LSR overmolding
Adhesion Testing
Durability validation
Success Case
USB-C Interface Overmolding Project
We provided complete overmolding solutions for a mobile accessory manufacturer, including substrate surface treatment, mold design, and molding process optimization. Products passed 10,000+ insertion tests and IP68 waterproof testing, achieving cumulative production of 1 million units.